0.65 Pitch BGA Compression Mount
| Mechanical Characteristics |
Contact system |
Normally compressed |
Package insertion force |
ZIF |
Contact force |
Typical: Approximately 15g/pin
Range: 10–20g/pin |
Durability |
Minimum: 10,000 cycles |
Temperature range |
-55°C to 150°C |
Contact point |
Side of solder ball |
Maximum IC offset |
During load: ±1.0 mm in X or Y axis |
Actuation force |
Typical: 1.0kg |
| Electrical Characteristics |
Current rating |
1 amp per pin |
Insulation resistance |
1000 mohms at 500V DC |
Dielectric voltage |
Withstands 700V AC for 1 minute |
Contact resistance at 10mA |
Initial: 50 mohm maximum initial
After 10K cycles: 1 ohm maximum |
Inductance |
6nH at 50 MHz, approximately |
| Product Accommodations |
I/O |
Maximum: 27x27 array |
IC size |
Maximum: 15x15mm |
0.65 Pitch BGA Pinch Mount
| Mechanical Characteristics |
Contact system |
Normally closed |
Package insertion force |
ZIF |
Contact force |
Typical: Approximately 15g/pin
Range: 10–20g/pin |
Durability |
Minimum: 10,000 cycles |
Temperature range |
-55°C to 150°C |
Contact point |
Side of solder ball |
Maximum IC offset |
During load: ±1.0 mm in X or Y axis |
Actuation force |
Typical: 1.0kg |
| Electrical Characteristics |
Current rating |
1 amp per pin |
Insulation resistance |
1000 mohms at 500V DC |
Dielectric voltage |
Withstands 700V AC for 1 minute |
Contact resistance at 10mA |
Initial: 50 mohm maximum initial
After 10K cycles: 1 ohm maximum |
Inductance |
6nH at 50 MHz, approximately |
| Product Accommodations |
I/O |
Maximum: 14x14 array |
IC size |
Maximum: 11x11mm |
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