Sensata IC | LGA (Land Grid Array) Burn-In Test Socket Packages by Sensata

Burn-in Sockets
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Site Updated February 16, 2018

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LGA (Land Grid Array) Burn-in Test Socket Packages

Mechanical Characteristics
Contact system	Custom hybrid pogo pin with up to 2,500 contacts at various pitches
Package insertion force	Zero
Contact force	Average: 25 grams
Durability	Minimum: 3,000 insertions
Thermal resistance of heatsink	Less than 2.5°C per watt (varies with application)
Temperature range	-40°C to 150°C

Electrical Characteristics
Current rating	1 amp per pin
Insulation resistance	1000 mohms at 500V DC
Dielectric voltage	Minimum: 1,000 AC for 1 minute
Contact resistance	Maximum: 0.01 ohms
Inductance	<1.0 nH

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